Jonas Technology CO.,LTD


Language

Brand Concept

Jonas utilizes unique Ultra Fine Bubble technology, AOP advanced oxidation-reduction technology, and AIoT cloud-based artificial intelligence.

Main applications in water treatment: oxygenation, antibacterial properties, and ammonia nitrogen reduction.

Agriculture and Fisheries: Hydroponics & Aquaculture.

Healthcare: Water purification & redox balance.

Electronics and semiconductor industry: wafer cleaning & AI server component cleaning.

Through the AIoT cloud-based artificial intelligence monitoring system: collect, record, and analyze operations.

Jonas upholds service and integrity, strives to develop products that are green and human-centered, responds to environmental protection, and creates a green and clean life.

Applications and Benefits of Ultra Fine Bubbles (UFB) in Wafer Cleaning

1. Technical Principle

Ultra Fine Bubbles (UFB) refer to bubbles with a diameter smaller than 1 micron. They feature a high specific surface area, long residence time in water, and charged interfaces, which effectively enhance cleaning efficiency.

2. Key Benefits

  1. Improved cleaning efficiency: UFB generates microjets and localized high-energy effects during collapse, helping remove nanoscale particle contaminants.
  2. Reduced chemical usage: Lowers the need for chemicals in RCA cleaning, enabling greener processes.
  3. Enhanced surface cleanliness: UFB can penetrate fine and high aspect ratio structures, improving cleaning uniformity.
  4. Reduced surface damage: Compared to traditional mechanical cleaning, UFB is a non-contact method that minimizes wafer surface scratches.
  5. Improved drying performance: Bubble collapse helps break water films and accelerates drying.

3. Application Scenarios

  1. Post-CMP cleaning (removal of SiO2 / CeO2 particles)
  2. Post-etch cleaning
  3. Final cleaning

4. Comparison with Traditional Cleaning

UFB can be integrated with megasonic and chemical cleaning to improve efficiency and reduce defect rates.

5. Future Development

By combining AIoT monitoring and AOP technology, the cleaning quality and stability of semiconductor processes can be further optimized.